What is bonding wire?

Bond wire is the main material used in semiconductor packaging, which is the part connecting pins and silicon wafers and conveying electrical signals. It is an indispensable core material in semiconductor production. With only a quarter of a meter in diameter, the production of bonding wire requires high strength, ultra-precision and high temperature resistance.

Bonding wire can be divided into : bonding gold wire and bonding silver wire.

Bond alloy line is a kind of internal lead material with excellent electrical, thermal conductivity, mechanical properties and chemical stability. It is mainly used as a key packaging material for semiconductors (bond wire, frame, plastic sealing material, solder ball, high-density packaging substrate, conductive adhesive, etc.). It acts as a wire connection in the LED package, connecting the chip surface electrode and the bracket. When conducting current, the current enters the chip through the gold wire and makes the chip glow.

Bonded silver wire is an alternative to traditional gold wire in LED and IC industries in recent two years. As the price of gold has been rising in the past two years, the price of gold wire used in Led and IC packaging has also been increasing. At the same time, the price of products has been falling. Therefore, a cheap alternative, silver alloy wire, should be available.